Picture of Wafer Dicing Service (Internal Tyndall)
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Finbarr Waldron
2nd Responsible:
Kenneth Rodgers
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Description
Details
Tool name:
Wafer Dicing Service (Internal Tyndall)
Area/room:
A.1.2.02 Packaging & Component Analysis Lab
Category:
Sawing
Manufacturer:
DISCO
Model:
Dicing Service
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