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 NameCategoryManufacturerModel
View NanoindenterOther processesBrukerHysitron TI Premier
View 3D Optical Microscope SystemOther processesKeyenceVHX2000
View 3D Prototyping SystemOther processesLPKFProtolaser 3D
View Aluminium Wedge-Wedge Wire BonderDevice mountingTPTHB12
View Automatic Dicing SawSawingDISCODAD3350
View High Temperature Vacuum OvenOther processesHeraeusN/a
View Hitachi ArBlade 5000 Ion Beam Milling SystemSample prepHitachiArBlade 5000
View Instron Mechanical TesterMetrologyInstron5565
View Logitech PM5 Lapping & Polishing SystemSample prepLogitechPM5
View Logitech PM6 Lapping & Polishing SystemSample prepLogitech1BL64
View Mechanical Shock & Vibration Test SystemOther processesN/aN/a
View Microsectioning Service (Internal Tyndall)Sample prepMircosectioningMicrosectioning Service
View Optical Microscope - Olympus BH2Other processesOlympusBH2
View Optical Microscope - Olympus SZX12Other processesOlympusSZX12
View Packaging Service (Internal Tyndall)Device mountingPackaging & AssemblyPackaging Service
View RADFET Testing MetrologyTyndall00
View Royce 552 Mechanical TesterMetrologyRoyce552
View Scanning Acoustic MicroscopeMetrologySonoscanD9000
View Temperature / Humidity Test Chamber 1Other processesWeiss Tecknik WK2-120 & HC7033
View Temperature / Humidity Test Chamber 2Other processesHeraeus-VotschN/a
View Temperature Cycling Oven 1Other processesN/aN/a
View Temperature Cycling Oven 2Other processesN/aN/a
View Thermal Shock Test Chamber 1Device mountingVotschN/a
View Thermal Shock Test Chamber 2Other processesVotschN/a
View TPT HB16 Gold & Copper Wire BonderDevice mountingTPTHB16
View Vacuum Curing OvenDevice mountingHeraeusVT 5042
View Wafer Dicing Service (Internal Tyndall)SawingDISCODicing Service
View Wire Bond Pull / Die Shear TesterMetrologyRoyce552
View X-Ray Imaging System (Nordson-Dage)MetrologyNordson DageDiamond II XD7600NT
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