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| Nanoindenter | Other processes | Bruker | Hysitron TI Premier |
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| 3D Optical Microscope System | Other processes | Keyence | VHX2000 |
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| 3D Prototyping System | Other processes | LPKF | Protolaser 3D |
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| Aluminium Wedge-Wedge Wire Bonder | Device mounting | TPT | HB12 |
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| Automatic Dicing Saw | Sawing | DISCO | DAD3350 |
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View
| Gold & Copper Wire Bonder | Device mounting | TPT | HB16 |
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| High Temperature Vacuum Oven | Other processes | Heraeus | N/a |
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View
| Hitachi ArBlade 5000 Ion Beam Milling System | Sample prep | Hitachi | ArBlade 5000 |
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View
| Instron Mechanical Tester | Metrology | Instron | 5565 |
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| Lab A.1.2.02 - Packaging Laboratory - User 3 | Other processes | Tyndall | C.2.06 |
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| Lab A.1.2.02 - Packaging Laboratory - User 4 | Other processes | Tyndall | C.2.06 |
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View
| Lab A.1.2.02 - Packaging Laboratory - User 5 | Other processes | Tyndall | Tyndall |
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View
| Lab A.1.2.02 - Packaging Laboratory - User 6 | Other processes | Tyndall | Tyndall |
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View
| Lab A.1.2.02 - Packaging Laboratory - User 1 | Other processes | Tyndall | C.2.06 |
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View
| Lab A.1.2.02 - Packaging Laboratory - User 2 | Other processes | Tyndall | C.2.06 |
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View
| Lab A.1.2.08 - Reliability Test Lab - User 1 | Other processes | Tyndall | A.2.08 |
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| Lab A.1.2.08 - Reliability Test Lab - User 2 | Other processes | Tyndall | A.2.08 |
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| Lab A.1.2.08 - Reliability Test Lab - User 3 | Other processes | Tyndall | Tyndall |
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| Mechanical Shock & Vibration Test System | Other processes | N/a | N/a |
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| Microsectioning Service (Internal Tyndall) | Sample prep | Mircosectioning | Microsectioning Service |
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View
| Optical Microscope - Olympus BH2 | Other processes | Olympus | BH2 |
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| Optical Microscope - Olympus SZX12 | Other processes | Olympus | SZX12 |
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| Packaging Service (Internal Tyndall) | Device mounting | Packaging & Assembly | Packaging Service |
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| RADFET Testing | Metrology | Tyndall | 00 |
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| Royce 552 Mechanical Tester | Metrology | Royce | 552 |
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| Scanning Acoustic Microscope | Metrology | Sonoscan | D9000 |
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View
| Semi-Automatic Dicing Saw (Older Saw) | Sawing | DISCO | DAD 2H/6T |
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View
| Temperature / Humidity Test Chamber 1 | Other processes | Weiss Tecknik | WK2-120 & HC7033 |
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View
| Temperature / Humidity Test Chamber 2 | Other processes | Heraeus-Votsch | N/a |
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View
| Temperature Cycling Oven 1 | Other processes | N/a | N/a |
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| Temperature Cycling Oven 2 | Other processes | N/a | N/a |
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View
| Thermal Shock Test Chamber 1 | Device mounting | Votsch | N/a |
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View
| Thermal Shock Test Chamber 2 | Other processes | Votsch | N/a |
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View
| Vacuum Curing Oven | Device mounting | Heraeus | VT 5042 |
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View
| Wafer Dicing Service (Internal Tyndall) | Sawing | DISCO | Dicing Service |
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View
| Wafer Thinning System (Logitech PM5) | Sample prep | Logitech | PM5 |
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View
| Wire Bond Pull / Die Shear Tester | Metrology | Royce | 552 |
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View
| X-Ray Imaging System (Nordson-Dage) | Metrology | Nordson Dage | Diamond II XD7600NT |