The DAD 3350 is an automatice wafer dicing saw capable of handling wafers of up to 200mm (8 inches) in diameter. Howver, with the current tooling available at Tyndall, the maximum wafer size which can be processed is 150mm (6 inches). The saw can be used for the dicing of Si, Compound Semiconductors, Glass, Pyrex, Sapphire and other materials. The system may be operated by trained & licensed personnel only.