Picture of Wafer Thinning System (Logitech PM5)
Current status:
AVAILABLE
Book | Log
Show/Collapse all

1st Responsible:
2nd Responsible:
You must be logged in to view files.

The Logitech PM5 is a grinding & polishing system for thinning semicinductor wafers and wafer pieces. The maximum sigle sized piece which the system can handle is a 100mm (4-inch) wafer.

Tool name:
Wafer Thinning System (Logitech PM5)
Area/room:
A.1.2.02 Packaging & Component Analysis Lab
Category:
Sample prep
Manufacturer:
Logitech
Model:
PM5

Instructors

Licensed Users

You must be logged in to view tool modes.