The PM6 Precision Lapping & Polishing system produces results typically found on production scale equipment. Highly flexible in use, the PM6 allows users to work with many different materials including; gallium arsenide, silicon, rock and soils. This system provides the ability to produce specimens repeatably with superior quality and surface

finish. Precise plate set-up options combined with an intuitive control system provide an effortless consistency of results with a very high degree of accuracy.

Wherever there is a need for a controlled flat surface with a high quality finish the PM6 makes an invaluable investment. The PM6 system offers enhanced process performance through a combination of innovative designs and intuitive operator
controls.

• Single workstation with a wafer process capacity of up to 4”/100mm – driven jig roller arms greatly increases accuracy and repeatability.
• Plate speeds of between 5 and 100rpm, which facilitates faster lapping and polishing rates.
• The recipe mode feature allows operators to create, save and re-call multi-stage process recipes.
• The metered abrasive feed unit, via the peristaltic pumps, allows operators to set the flow rate of between 1-100ml per minute. This greatly increases the quality and the accuracy of results, while reducing both wastage and operational costs.
• Customers are achieving increased material removal rates (MRR), with far greater control, compared to similar systems without metered abrasive delivery or a driven-jig-arm functionality.
• All process conditions are controlled via the Graphical User Interface (GUI), including: plate speeds, material removal rates, driven jig arm, the metered abrasive feed – giving the operator complete control.
• The automatic drip detector will stop the plate rotating when the abrasive cylinders are empty – thereby avoiding any damage to the specimen running on a dry plate.
• Real time data collection and feedback via Bluetooth to allow users to export information via the USB port for external analysis.
• Bluetooth automatic-plate-flatness control provides continuous in-situ measurement of the plate flatness.

Key Features

• Process up to 100mm/4″ wafers
• Up to 100rpm plate speed facilitating faster lapping rates
• Driven jig roller arm with linear sweep
• Bluetooth enabled features
• Automatic plate flatness control