Picture of Gold & Copper Wire Bonder
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Kenneth Rodgers
2nd Responsible:
Paul Tassie
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Description
Details
Tool name:
Gold & Copper Wire Bonder
Area/room:
A.1.2.02 Packaging & Component Analysis Lab
Category:
Device mounting
Manufacturer:
TPT
Model:
HB16
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